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Informist, Saturday, Feb. 21, 2026

 

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--Roshni Nadar: India Chip to help markets with 36 mln chips/month 
--CONTEXT:HCL Tech Chairperson Roshni Nadar at co JV's event in Uttar Pradesh 
--Foxconn Chen: Aim to build reliable assembly, testing facility in India 
--CONTEXT: Foxconn semicon business head Chen at JV's event in Uttar Pradesh 
--PM Modi: India semiconductor journey started late but progressing fast 
--CONTEXT:PM Modi's comments in virtual address at HCL Tech JV's event in UP

 

NEW DELHI – India may have had a late start to its journey in the semiconductor sector but it is today moving forward at a faster pace, Prime Minister Narendra Modi said in a virtual address at the ground breaking ceremony of India Chip Pvt. Ltd., the joint venture between HCL Group and Hon Hai Precision Industry Co. Ltd. (Foxconn). The prime minister added that four of the 10 semiconductor fabrication and packaging units approved under the India Semiconductor Mission are going to start production soon.

 

"Because of this semiconductor factory, the youth of Uttar Pradesh, the youth of India will get jobs in big numbers because where semiconductor units come, there design houses come up, R&D centres come up, startup ecosytems are built, and all of this is now going to happen in UP as well," Modi said.

 

Earlier this week, sectretary of the Ministry of Electronics and Information Technology had said India's first commercial semiconductor production is expected to begin by the end of this month. US-based Micron Technology, Inc. is setting up an assembly, test, marking, and packaging facility in Sanand, Gujarat, entailing an investment of over INR 225 billion.  

 

 

"India Chip is India's very first display driver integrated circuit OSAT (outsourced semiconductor assembly and test) facility which translates the vision of Atmanirbhar Bharat into on-ground reality," HCL Group Chairperson Roshni Nadar Malhotra said, adding that with 20,000 wafers and nearly 36 million display driver chips per month, the facility will serve domestic demand as well as international markets.

 

Bob Chen, president of Foxconn's Semiconductor Business Group, said the global electronics manufacturing giant's objective is to establish a reliable assembly and testing operation in India. "...We are laying a foundation that can evolve over time from introducing the first wafer-level packaging capability in India towards...future advanced packaging technologies," he added.

 

India Chip is a 60:40 joint venture between HCL Group and Foxconn. Its advanced outsourced semiconductor assembly and test facility at Jewar in Greater Noida is expected to be operational by 2028, the two players said in a press release, adding that an investment of INR 37 billion has been earmarked for the facility over the next few years.  End

 

Reported by Shakshi Jain and Afra Abubacker

Edited by Akul Nishant Akhoury

 

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