Semiconductor Projects
Cabinet approves 4 semiconductor projects in 3 states for INR 46 billion
This story was originally published at 15:59 IST on 12 August 2025
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--Cabinet OKs four semiconductor projects in Odisha, Andhra, Punjab
--Cabinet OKs INR 45.94 bln for four semiconductor projects
NEW DELHI – The Cabinet Tuesday approved setting up four semiconductor manufacturing plants in Odisha, Punjab, and Andhra Pradesh under the India Semiconductor Mission at a cumulative investment of INR 46 billion. The four projects from SiCSem, Continental Device India Pvt. Ltd., 3D Glass Solutions Inc., and Advanced System in Package Technologies will take the total approved projects under the mission to 10 with cumulative investments of around INR 1.60 trillion in six states, an official release said.
SiCSem and 3D Glass Solutions Inc. will set up two projects in Odisha. SicSem will build India's first commercial compound fab, making silicon carbide devices. The facility will have an annual capacity of 60,000 wafers and a packaging capacity of 96 million units. These units will address applications in missiles, defence equipment, electric vehicles, railway, fast chargers, data centre racks, consumer appliances, and solar power inverters, the release said.
3D Glass Solutions will set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley in Bhubaneshwar. It is expected to have a capacity of approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum, the release said.
Advanced System in Package Technologies will set up a semiconductor manufacturing unit in Andhra Pradesh in collaboration with South Korea's APACT Co. Ltd. This facility will have an annual capacity of 96 million units. "The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products," the release said.
Continental Device India will expand its discrete semiconductor manufacturing facility at Mohali in Punjab to make high-power discrete semiconductor devices. This brownfield expansion is expected to increase the annual capacity to 158.38 million units. The products will be useful in electric vehicles, renewable energy systems, power conversion applications, industrial applications, and communication infrastructure, the release said. End
Reported by Anand JC
Edited by Saji George Titus
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